2.5oz Heat Sink Compound U1001-056

Saminco's Heat Sink Compound (2.5 oz, U1001‑056) is a high-quality thermal interface paste designed to improve heat transfer between electronic components and heat sinks. Its silicone-based formula, enriched with thermally conductive fillers, fills microscopic gaps and irregularities between surfaces to ensure efficient heat dissipation, helping components run cooler and last longer. The 2.5 oz pack is ideal for multiple applications, including power transistors, regulators, and other heat-generating modules. The compound remains stable over time, does not harden or bleed excessively, and is safe for use on metal surfaces while being compatible with many plastics and rubbers. For optimal performance, clean the surfaces before application and apply a thin, even layer—too much paste can reduce thermal conduction. Perfect for electronics assembly and maintenance, this heat sink compound ensures reliable thermal management in demanding applications.
Key Features
- High-quality thermal interface paste for electronics and heat sinks
- Silicone-based formula with thermally conductive fillers for efficient heat transfer
- Fills microscopic gaps between surfaces to reduce component temperatures
- Pack size: 2.5 oz, suitable for multiple applications
- Stable over time; does not harden or bleed excessively
- Safe for metal surfaces and compatible with many plastics and rubbers
- Easy application: clean surfaces and apply a thin, even layer for optimal performance
- Ideal for power transistors, regulators, and other heat-generating modules